Prelims: Current events of national and international importance | Economy
Why in News?
Recently, India has launched Semicon 2.0, a comprehensive programme to strengthen the country’s semiconductor design and manufacturing ecosystem.
- Semicon 2.0 - Expansion of the India Semiconductor Mission (ISM) designed to holistically build a complete chip design and manufacturing ecosystem in the country.
- Aim – To position India as a global semiconductor design intellectual property (IP) hub.
Six Pillars of Semicon 2.0
- Design – Deepen chip design capabilities, focus on IP and system designs.
- Machines and Materials – Incentivise companies in manufacturing and R&D of machines, chemicals, gases essential for semiconductor production, which supports precision manufacturing.
- Fabs – First fab scheduled for 2028; includes silicon fabs, compound semiconductor fabs, discrete component fabs, display fabs.
Fab – Semiconductor fabrication (fab) plant.
- ATMP/OSAT – Strengthen Assembly, Testing, Marking, Packaging (ATMP) and Outsourced Semiconductor Assembly and Test (OSAT); India emerging as an alternative location for advanced ATMP technologies.
- Research & Development – Current nodes are 28nm–110nm; focus on developing advanced nodes and technologies in collaboration with leading R&D centres in India and abroad.
- Talent Development – 315 universities engaged in chip design training with latest EDA tools, further deepen the training in college.
Reference
PIB | Semicon 2.0
