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Design Linked Incentive (DLI) Scheme

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January 07, 2026

Mains: GS III – Indian Economy and issues relating to planning, mobilisation, of resources

Why in News?

The Design Linked Incentive (DLI) Scheme is a key instrument in advancing India’s semi-conductor ambitions and to develop a strong fabless capability.

What is the DLI scheme?

  • Design Linked Incentive (DLI) Scheme – It is a key instrument in advancing India’s ambition to develop a strong fabless capability.
  • It supports semiconductor design across the full lifecycle—from design and development to deployment—covering
  • Integrated Circuits (ICs), chipsets, Systems-on-Chip (SoCs), systems and IP cores.
  • Aim – By promoting indigenous semiconductor content and intellectual property in electronic products, reduce import dependence.
    • Strengthen supply chain resilience, and enhance domestic value addition.
  • Implementation – By the Ministry of Electronics and Information Technology (MeitY).
  • Eligibility – The following are eligible for financial incentives for deploying semiconductor designs.
    • MSMEs — Defined according to the Ministry of Micro, Small and Medium Enterprises notification, 1 June 2020.
    • Startups — Defined as per the Department for Promotion of Industry and Internal Trade (DPIIT) notification, 19 February 2019.
    • Domestic companies — Defined as those which are owned by resident Indian citizens, as per the Foreign Direct Investment (FDI) Policy Circular, 2017 or extant norms.

What support is provided under the scheme?

  • Financial incentives
  • Product Design Linked Incentive – Reimbursement of up to 50% of eligible expenditure and is capped at ₹15 crore per application.
  • The support is available to entities involved in semiconductor design for –
    • Integrated Circuits (ICs) Chipsets Systems on Chips (SoCs) Systems
    • IP Cores Semiconductor-linked designs.
  • Deployment Linked Incentive – Incentives of 6% to 4% of net sales turnover are provided for five years.
    • The incentive is capped at ₹30 crore per application.
    • The minimum cumulative net sales required over Years 1–5 is 1 crore for startups/ ₹ MSMEs and 5 crore for other domestic companies.
  • The design must be successfully deployed in electronic products.
  • Design infrastructure support
  • C-DAC has established the ChipIN Centre under the DLI Scheme to facilitate the design infrastructure support to approved companies.
  • National EDA (Electronic Design Automation) Tool Grid — Remote access to the centralized facility of advance EDA tools for chip design activities will be provided to start-ups and MSMEs.
  • IP Core repository — Flexible access to the repository of IP Cores for SoC design activities.
  • MPW Prototyping support —Fiscal support for fabricating the design in MPW manner at semiconductor foundries.
  • Post-silicon validation support — Fiscal support for testing and validation of the fabricated ASIC and silicon bring-up activities.

What are the programme highlights & key achievements of DLI?

  • ChipIN Centre – It has democratized access to advanced EDA tools for chip design for about 1 lakh engineers and students across 400 organizations nationwide.
    • It is the world’s largest user base of a centralized chip design facility.
  • This includes around 305 academic institutions under the Chips to Start-up (C2S) Programme and 95 startups under the DLI Scheme
    • This reducing entry barriers for early-stage innovators.
  • India’s shared EDA Grid — A national platform offering high-end chip design software has recorded 54,03,005 hours of cumulative usage by 95 supported start-ups as of 2nd January 2026.
  • Strengthening skill baseover 1,000 specialised engineers have been trained or engaged through DLI-supported projects, strengthening India’s design talent base.

What are key institutional frameworks for semiconductor design?

  • Ministry of Electronics and Information Technology (MeitY) MeitY leads national semiconductor initiatives, provides policy direction, and anchors schemes.
  • It also coordinates institutional and industry partnerships to strengthen India’s chip design and manufacturing ecosystem
  • Semicon India Programme (SIM) – With an outlay of ₹76,000 crore, this supports investments in semiconductor and display manufacturing as well as the design ecosystem.
  • It ensures end-to-end backing for design, fabrication and productisation.
  • Chips to Startup (C2S) Programme – It is an umbrella capacity building programme initiated at academic organizations.
  • It has spread across the country to generate 85 thousand number of industry-ready manpower at B.Tech, M.Tech, and PhD levels specialized in semiconductor chip design.
  • Microprocessor Development Programme – initiated at C-DAC, development and fabrication of open-source architecture-based family of microprocessors
    • viz. VEGA12, SHAKTI13 and AJIT microprocessors as a step towards self-reliance.

What are the companies that stands out as leading examples?

  • Vervesemi Microelectronics – With a strong portfolio of 110+ semiconductor IPs, 25 integrated circuit (IC) product variants,
  • 10 granted patents, and 5 trade secrets is developing motor-control chips for a wide range of applications.
  • InCore Semiconductors – It is focused on the design and development of indigenous RISC-V microprocessor IPs and SoC design automation tools.
  • These initiatives with the ultimate goal of building India’s most powerful embedded processor, Dolomite, targeted at entry-level smartphones and edge-AI applications.
  • Netrasemi It is focused on designing AI-capable SoCs for CCTV secure surveillance, smart sensors, robotics and drones, and mobility applications.
  • The company has successfully taped out India’s first indigenously designed AI SoC in an advanced 12 nm process node, integrating in-house AI/ML accelerators, vision processing, and video engines.
  • AAGYAVISION – It is designing advanced radar-on-chip that operate reliably in all weather conditions,
  • And driving advancements in safety, security, smart infrastructure, edge computing, and
  • Emerging 6G sensor networks as well as critical application like drone detection.

What lies ahead?

  • The DLI Scheme is critical to anchoring India in the most strategic and value-intensive segment of the global semiconductor value chain—chip design.
  • The scheme also enables high-value growth by translating deep-tech innovation into globally competitive products, fostering startups and building skilled workforce.
  • These outcomes are already evident, positioning Indian companies as credible global suppliers while strengthening domestic supply chains and reinforcing India’s self-reliant semiconductor ecosystem.

Quick facts

Fabless chip design

  • Fabless semiconductor companies hold the highest strategic value because they design the chips that drive product intelligence, efficiency, and security.
  • While fabs manufacture silicon and EMS firms assemble devices, more than half of a semiconductor’s value comes from design and IP, not physical production.
  • Fabless semiconductor design models generate high value addition with relatively modest capital expenditure,
    • Whereas design and IP contribute disproportionately to product economic value.

Reference

PIB| Design Linked Incentive (DLI) Scheme

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